先进封装技术演进-2.5D➢ 图表：主要公司硅桥封装的技术路线图Embedded Multi-die InterconnectBridgeIntegrated Fan-out with Local SiliconInterconnectCoWoS-LChip-on-Wafer-on-Substrate - LocalSilicon InterconnectsFO-EBStack Fan-out embedded bridgeFOCoS-BFan-out chip on substrate-bridgeS-ConnectSilicon Connect技术EMIBInfo-L公司IntelTSMC矽品精密ASEAmkor量产量产Intel, AmazonApple2025量产NvidiaAMDAMD量产量产小批量量产未量产小批量量产中国客户Si中介层量产/硅桥已验证未量产中国客户研发研发2025研发研发未量产研发全称Chip First Chip Last or Middle 基板内/基板上 模塑封内 硅桥中进行TSV状态客户有机基板内EMIB-TFO-EB-ISamsungI-CubeEInterposer Cube Embedded长电科技XDFOI-EBX-Dimension Fan-Out Integration –Enhanced Bonding盛合晶微2.5D2.5DSmartPoser-BDIBMPTINepesDBHiPiFOMold Int with SiBridgeDirect Bonded HeterogeneousIntegrationPillar in Fan-outMold Interposer with Si Bridge奕成科技CM-MCMChip Middle Multi chip ModuleA-star IMEAOIEFIPSBEmbedded Fine InterconnectPillar Suspended BridgeMstechFO bridgeFan-out with bridge有机基板上？华天科技eSInCEmbedded System in Chip在硅基板内数据来源：Yole，金元证券研究所整理
